MPM BTB100 Automatic Stencil Printer Momentum II 220V 110V
Contact Person : Shelly Xu
Phone Number : 86 13316012003
WhatsApp : +8613316012003
|Voltage:||220V Or 110V||Automatic Grade:||Automatic|
|Warranty:||1 Year||Name:||Automatic SMT Stencil Printer|
|Application:||SMT PCB Assembly Production Line||Lead Time:||35 Days|
|Model No:||G9||Quality:||100% Tested, Top Quality|
GKG G9 Automatic Solder Paste Printer,
GKG G9 smd stencil printer,
vision printing Automatic Solder Paste Printer
GKG G9 SMT Stencil Printing Machine
G9 automatic vision printing machine is a new product for high-end SMT applications, which can perfectly meet the process requirements of 03015, 0.25pich and other fine pitch, high precision and high speed.
Standard function introduction
1. CCD digital camera system
Brand-new optical path system--uniform ring light and high-brightness coaxial light, together with the brightness function that can be adjusted steplessly, makes all types of Mark points (including uneven Mark points) can be well identified and suitable for plating. Tin, copper-plated, gold-plated, tin-sprayed, FPC and other types of PCBs with different colors.
2. High-precision PCB thickness adjustment jacking platform
The structure is compact and reliable, the lifting is stable, and the PIN needle height is automatically adjusted by software, which can accurately adjust the position and height of PCB boards with different thicknesses.
3. Guide rail positioning system
International utility model invention patent. Detachable, programmable flexible side clamp device, for soft board, warped PCB, a unique top flattening, through software programming, can be automatically stretched, does not affect the tin thickness.
4. Brand new scraper structure design
Through the new scraper structure of the slide rail and the cylinder, the operation stability is improved and the service life is prolonged.
5. High-speed stencil cleaning
The drip-type cleaning structure can effectively prevent the cleaning caused by local lack of solvent caused by the blocking of the solvent pipe.
6. New multi-function interface
Simple and clear, easy to operate. Real-time temperature remote control function.
1. Steel mesh inspection function
By compensating the light source above the stencil, and using CCD to check the mesh of the stencil in real time, so as to quickly detect and judge whether the stencil is blocked after cleaning, and perform automatic cleaning, which is a 2D inspection of the PCB board. Replenish.
2. Automatic dispensing system
According to different printing process requirements, after printing, the PCB board can be accurately dispensed, tinned, drawn, filled and other functions; at the same time, the dispensing head is also equipped with a heating function, which can be used at a lower ambient temperature. When heating, the glue is heated to improve the fluidity of the glue.
3. Bottle type automatic tinning and solder paste detection function
Automatically add solder paste at regular and fixed points to ensure the quality of the solder paste and the amount of solder paste in the stencil. So as to ensure the printing quality of customers and improve productivity.
Through the sensor, the amount of solder paste on the stencil is managed, and the quality is stable and long-term continuous printing is possible. Productivity is improved.
4. SPI connection
It is connected with SPI to form a closed-loop system. When the feedback information of poor SPI printing is received, the machine will automatically adjust according to the SPI feedback offset. The XY direction offset can be automatically adjusted in 3PCS, and the stencil can be cleaned to improve printing. Quality and production efficiency constitute a complete printing feedback system.
5. Leading the compatibility of Industry 4.0
6. Through the automatic upload or output of machine status and parameters, it can provide a strong guarantee for the customer's Industry 4.0 intelligent production. It can realize seamless connection with the customer's MES system, and realize the self-distribution of engineering personnel at all levels according to on-site management. permissions.
|Max bare board size(XxY)||400*340mm|
|Min bare board size(XxY)||50*50mm|
|Bare board thickness||0.4~6mm|
|Bare board Max weight||3Kg|
|Bare board edge clearance||2.5mm|
|Bare board height||15mm|
|Transport height||900 ± 40mm|
|Transport speed||Segment control 1500mm/s(Max)|
|Transport method||One stage transport guide|
|Bare board clamping||Automatic retractable upper tablet|
|flexible side clip|
|Vacuum adsorption function|
|Bare board support Method||Magnetic Thimble|
|Manually adjust the jacking platform|
|Max printing area (X x Y)||530*340mm|
|Printing mode||Single or double doctor blade printing|
|scraper type||Rubber Scraper/Steel Scraper (Angle 45/55/60)|
|Template frame size||370*370mm~737*737mm|
|Cleaning method||Enhanced vacuum adsorption function|
|Dry, wet, vacuum three modes|
|cleaning back and forth|
|Datum point type||Standard shape reference point|
|Camera system||Vision system for top/bottom imaging|
|Geometry match positioning|
|System alignment accuracy and repeatability||±12.5um@6σ,CPK≥2.0|
|Actual solder paste placement repeatability||±18um@6σ,CPK≥2.0|
|Repeatability of actual solder paste printing position based on third-party test system (CTQ, Germany) verification|
|printing cycle||<7.5 sec (excluding printing and cleaning time)|
|Compressed Air Requirements||4~6 Kgf/cm2|
|Air consumption||around 5L/min|
|Working environment humidity||30%~60%|
|Machine height (remove tri-color light)||1530(H)mm|
|Machine weight||Approx: 1000Kg|