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Principle of Laser Marker-"Cold Working"


The "cold processing" of laser markers has high-energy (ultraviolet) photons, which can break the chemical bonds in materials (especially organic materials) or the surrounding medium to cause non-thermal process damage to the materials. This kind of cold processing is of special significance in laser marking processing, because it is not thermal ablation, but cold peeling that does not produce the side effects of "thermal damage" and breaks the chemical bond, so it has no effect on the inner layer and nearby areas of the processed surface. Produce heating or thermal deformation. For example, in the electronics industry, excimer lasers are used to deposit thin films of chemical substances on base materials and to cut narrow grooves on semiconductor substrates.

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